VOLCANO® 100UV Laser Optics
Systems > Laser-Lift-Off
Laser Optics for a Laser Line of 100mm Length using Pulsed Solid State UV Lasers
The VOLCANO® 100UV Laser Optics is built into a solid granite structure. The beam is homogenized into a 100mm long line beam with a typical width of 20 - 30µm. The FALCON 100UV projection lens assures a uniform line width and the large depth of focus which trouble-free production requires. A single TruMicro 7370 laser (180W, 10 kHz, 15-17ns) provides 18mJ pulse energy and gives an energy density of more than 400mJ/cm² in a 30µm FWHM line width, respectively the width can be expanded to 80µm for 150mJ/cm². Using a typical scan pitch of 50% of the FWHM the scan speed goes up to 400mm/s. Alternative laser sources operated at 355nm can be applied as well. However, the longer pulse duration of 50-70ns requires increased process energy density.
Scope of Application
Laser lift-off (LLO) processes are in use in the electronics industry for the production of high brightness LEDs, a market with a fast growing volume due for instance to the increasing use of energy saving room illumination. Besides the production of LEDs, LLO processes experience an increas-ing demand for the production of flexible displays for TV products, smartphones, smartwatches, tablet computers and electronic books. For these displays the functional film is produced on a rigid and flat glass substrates and subsequently transferred to a flexible carrier like a polymer foil by debonding it from the glass transport substrate.
Another application for LLO is the production of 3D stacked semicon-ductor devices. Devices manufactured on thin wafers of several 10µm thickness are stacked vertically. To process thin wafers they are often bonded to support carriers. Traditionally these carriers are silicon wafers. Debonding the thin device wafers from the thick support carriers after pro-cessing is a mechanical process during which a remarkable amount of mechanical stress is applied to the thin wafer. If the silicon carrier is replaced by a glass carrier, a laser lift-off process can be used which allows much gentler debonding with subsequently higher yield.
|Technical Data VOLCANO® 100UV-1|
20-30µm FWHM (Gaussian profile)
+/-6% (p2p~6 Sigma)
up to 420mJ/cm², up to 630mJ/cm² @ 20µm FWHM
| 50 - 150mm/s, depending on substrate|
TruMicro 7370 (Trumpf Lasertechnik)
laser power meter, substrate power meter, substrate beam profiler, fast photodiode
Other line sizes and other configurations on request.